Photos of alleged Sony Xperia Z4 metal frame leaked online which gives some design hints about the upcoming Sony flagship smartphone. Sony didn’t announce any major flagship device at the MWC this year while few of the other major OEMs including Samsung and HTC introduced their respective flagship devices.
One reason for not announcing the Xperia Z4 at MWC could be because the device was not ready yet. The latest photos of the alleged Z4 metal frame indicates that it is in the working stages. Earlier rumor suggested that the device will be unveiled by Sony at the MWC 2015 along side Samsung Galaxy S6 and HTC One M9 but that didn’t happen.
Talking about the metal frame in the photo, it resembles to the Z3 Sony OmniBalance design in a number of ways however it is said that Z4 frame is about 1mm thinner than Z3. Another noticeable change in the design of Z4 is that it now features an open microUSB port instead of a covered port in Z3 which indicate that Z4 might not support the IP certification to be water and dust resistant.
Few people suggest that there is no microSD card slot place in the metal design but looking closely at the photo, there is supposedly both SIM card and microSD card slot at the left side of the chassis.
These are just the design changes. There will be a lot of changes in the hardware specs as well like higher resolution display, faster processor and better camera. There are still no details about the available of the Xperia Z4 and when Sony will unveil its next flagship device.